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HD151TS302RP
Spread Spectrum Clock for EMI Solution
ADE-205-655A (Z) Preliminary Rev. 1 Sep. 2001 Description
The HD151TS302 is a high-performance Spread Spectrum Clock modulator. It is suitable for low EMI solution.
Features
* Supports 10 MHz to 60 MHz operation. (Designed for XIN = 24 MHz and 48 MHz) * 1 copy of clock out with spread spectrum modulation @3.3 V * 1 copy of reference clock @3.3 V * Programmable spread spectrum modulation (-0.5%, -1.0%, -3.0% down spread modulation and spread spectrum disable mode.) * SOP-8pin * Pin to pin compatible with HD151TS301RP
Key Specifications
* Supply voltages : VDD = 3.3 V0.165 V * Ta = 0 to 70C operating range * Clock output duty cycle = 505% * Cycle to cycle jitter = 250 ps typ.
HD151TS302RP
Block Diagram
VDD GND
CLKOUT XIN OSC XOUT 1/n SSC Modulator SEL0 Mode Control SEL1 1/m Synthesizer SSCCLKOUT
Pin Arrangement
SSCCLKOUT
1
8
SEL1
VDD
2
7
CLKOUT
GND
3
6
SEL0
XIN
4
5
XOUT
(Top view)
Rev.1, Sep. 2001, page 2 of 9
HD151TS302RP
SSC Function Table
SEL1 :0 00 01 10 11 Spread Percentage -1.0% -3.0% SSC OFF -0.5%
Note: -3.0% SSC is selected for default by internal pull-up & down resistors.
Clock Frequency Table
XIN(MHz) 48 24 SSCCLKOUT(MHz) 48 24
*1 *1
CLKOUT(MHz) 48 24
*2 *2
Notes: 1. With spread spectrum modulation. 2. Without spread spectrum modulation.
Pin Descriptions
Pin name GND VDD CLKOUT SSCCLKOUT XIN XOUT SEL0 SEL1 No. 3 2 7 1 4 5 6 8 Type Ground Power Output Output Input Output Input Input Description GND pin Power supplies pin. Normally 3.3 V. Normally 3.3 V reference clock output. Spread spectrum modulated clock output. Oscillator input. Oscillator output. SSC mode select pin. LVCMOS level input. Pull-up by internal resistor. (100 k). SSC mode select pin. LVCMOS level input. Pull-down by internal resistor (100 k).
Rev.1, Sep. 2001, page 3 of 9
HD151TS302RP
Absolute Maximum Ratings
Item Supply voltage Input voltage Output voltage
*1
Symbol VDD VI VO IIK IOK IO
Ratings -0.5 to 4.6 -0.5 to 4.6 -0.5 to VDD+0.5 -50 -50 50 0.7
Unit V V V mA mA mA W C
Conditions
Input clamp current Output clamp current Continuous output current Maximum power dissipation at Ta = 55C (in still air) Storage temperature Notes:
VI < 0 VO < 0 VO = 0 to VDD
Tstg
-65 to +150
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability. 1. The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed.
Recommended Operating Conditions
Item Supply voltage DC input signal voltage High level input voltage Low level input voltage Operating temperature Input clock duty cycle VIH VIL Ta Symbol VDD Min 3.135 -0.3 2.0 -0.3 0 45 Typ 3.3 -- -- -- -- 50 Max 3.465 VDD+0.3 VDD+0.3 0.8 70 55 Unit Conditions V V V V C %
Rev.1, Sep. 2001, page 4 of 9
HD151TS302RP
DC Electrical Characteristics
Ta = 0 to 70C, VDD = 3.3 V5%
Item Input low voltage Input high voltage Input current Symbol VIL VIH II Min -- 2.0 -- -- Typ -- -- -- -- Max 0.8 -- 10 100 Unit V V A VI = 0 V or 3.465 V, VDD = 3.465 V, XIN pin VI = 0 V or 3.465 V, VDD = 3.465 V, SEL0, SEL1 pins V / ns 20% - 80% pF mA SEL0, SEL1 XIN = 24 MHz, CL = 0 pF, VDD = 3.3 V Test Conditions
Input slew rate Input capacitance Operating current CI
1 -- --
-- -- 7
4 4 --
DC Electrical Characteristics / Clock Output & SSC Clock Output
Ta = 0 to 70C, VDD = 3.3 V5%
Item Output voltage Symbol Min VOH VOL 3.1 -- Typ -- -- Max -- 50 Unit V mV Test Conditions IOH = -1 mA, VDD = 3.3 V IOL = 1 mA, VDD = 3.3 V
Rev.1, Sep. 2001, page 5 of 9
HD151TS302RP
AC Electrical Characteristics / Clock Output & SSC Clock Output
Ta = 25C, VDD = 3.3 V, CL = 30 pF
Item Cycle to cycle jitter
*1, 2
Symbol tCCS
Min -- -- -- -- --
Typ | 250 | | 250 | | 250 | | 250 | | 250 |
Max | 300 | | 300 | | 300 | | 300 | | 300 |
Unit Test Conditions Notes ps SSCCLKOUT, Fig1, 24 MHz SSCCLKOUT, Fig1, 48 MHz SSCCLKOUT, Fig1, 24 MHz SSCCLKOUT, Fig1, 48 MHz CLKOUT, Fig1, 24 MHz & 48 MHz MHz SSCCLKOUT, XIN = 24 MHz SSCCLKOUT, XIN = 48 MHz SSCCLKOUT, XIN = 24 MHz SSCCLKOUT, XIN = 48 MHz CLKOUT, 24 MHz CLKOUT, 48 MHz V/ns @48 MHz CLKOUT % KHz @48 MHz SSCCLKOUT MHz ms 0.4 V to 2.4 V SSC = -3.0% SEL1:0 = 01 SSC = -0.5% SEL1:0 = 11 SSC = -3.0% SEL1:0 = 01 SSC = -0.5% SEL1:0 = 11
Output frequency
*1, 2
23.7 47.0 23.1 45.9 23.8 47.3
-- -- -- -- -- -- -- 50 30 33 -- --
24.2 48.7 24.2 48.7 24.2 48.7 -- 55 -- -- 60 2
Slew rate
*1
tSL
*1 *1
1.0 45 -- -- 10 --
Clock duty cycle
Output impedance
Spread spectrum *1 modulation frequency Input clock frequency Stabilization time
*1,3
Notes: 1. Parameters are guaranteed by design and characterization. Not 100% tested in production. 2. Cycle to cycle jitter and output frequency are included spread spectrum modulation. 3. Stabilization time is the time required for the integrated circuit to obtain phase lock of its input signal after power up.
Rev.1, Sep. 2001, page 6 of 9
HD151TS302RP
SSCCLKOUT (or CLKOUT) tcycle n tcycle n+1
t CCS = (tcycle n) - (tcycle n+1)
Figure 1 Cycle to cycle jitter
Rev.1, Sep. 2001, page 7 of 9
HD151TS302RP
Package Dimensions
Unit: mm
4.89 5.15 Max 5 8
1
4
3.90 1.73 Max
0.034 *0.22 + 0.017 - 0.20 - 0.03
6.02 - 0.18 1.06 0 - 8
0.69 Max
0.114 0.14 + 0.038 -
1.27 *0.42 +0.063 -0.064 0.40 0.06
0.60 - 0.194
+ 0.289
0.10 0.25 M
Hitachi Code JEDEC EIAJ Mass (reference value) FP-8DC 0.08 g
*Dimension including the plating thickness Base material dimension
Rev.1, Sep. 2001, page 8 of 9
HD151TS302RP
Disclaimer
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi's or any third party's patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party's rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi's sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi's sales office for any questions regarding this document or Hitachi semiconductor products.
Sales offices
Hitachi, Ltd.
Semiconductor & Integrated Circuits Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: (03) 3270-2111 Fax: (03) 3270-5109
URL
http://www.hitachisemiconductor.com/
For further information write to:
Hitachi Semiconductor (America) Inc. 179 East Tasman Drive San Jose,CA 95134 Tel: <1> (408) 433-1990 Fax: <1>(408) 433-0223 Hitachi Europe Ltd. Electronic Components Group Whitebrook Park Lower Cookham Road Maidenhead Berkshire SL6 8YA, United Kingdom Tel: <44> (1628) 585000 Fax: <44> (1628) 585200 Hitachi Europe GmbH Electronic Components Group Dornacher Strae 3 D-85622 Feldkirchen Postfach 201, D-85619 Feldkirchen Germany Tel: <49> (89) 9 9180-0 Fax: <49> (89) 9 29 30 00 Hitachi Asia Ltd. Hitachi Tower 16 Collyer Quay #20-00 Singapore 049318 Tel : <65>-538-6533/538-8577 Fax : <65>-538-6933/538-3877 URL : http://semiconductor.hitachi.com.sg Hitachi Asia Ltd. (Taipei Branch Office) 4/F, No. 167, Tun Hwa North Road Hung-Kuo Building Taipei (105), Taiwan Tel : <886>-(2)-2718-3666 Fax : <886>-(2)-2718-8180 Telex : 23222 HAS-TP URL : http://www.hitachi.com.tw Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower World Finance Centre, Harbour City, Canton Road Tsim Sha Tsui, Kowloon Hong Kong Tel : <852>-(2)-735-9218 Fax : <852>-(2)-730-0281 URL : http://semiconductor.hitachi.com.hk
Copyright (c) Hitachi, Ltd., 2001. All rights reserved. Printed in Japan.
Colophon 5.0
Rev.1, Sep. 2001, page 9 of 9

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